BIGTREETECH heatsink for CB1 and CB1 eMMC

BIGTREETECH passive heatsink designed for CB1 and CB1 eMMC modules. Its black aluminium body and fins increase the available surface area for removing heat generated by the processor, which is particularly useful during long prints, when running a graphical interface or when the module shares an enclosure with power electronics.

The heatsink needs no power supply or firmware configuration. It is installed over the CB1 using a suitable thermal interface and the four mounting points provided around the module.

Main features

• Silent passive cooling with no fan or wiring.
• Black aluminium body with cooling fins.
• Geometry designed specifically for BIGTREETECH CB1 and CB1 eMMC.
• Four mounting points maintain contact with the thermal interface.
• Visible CB1 marking and a design integrated with BIGTREETECH carrier boards.

Compatibility

It is designed for the BIGTREETECH CB1 module and its CB1 eMMC version. It can be used when the module is installed on a BIGTREETECH carrier designed for CB1, provided that all four mounting points match and there is sufficient clearance around and above the fins.

Carrier boards in this ecosystem include the Manta M4P, M5P, M8P, Manta E3EZ and PI4B Adapter. A current option from our catalogue is the BIGTREETECH Manta M8P V2; also check the available enclosure height and the other installed components.

Installation

1. Switch the printer off completely and disconnect every power supply and USB cable.
2. Make sure you have a suitable thermal pad or interface and the correct screws for the carrier board. Do not guess the screw length.
3. Remove the protective films from the thermal interface without touching or contaminating its surface.
4. Align the heatsink with all four mounting points and check that it contacts the intended areas of the CB1 without pressing on connectors or components.
5. Tighten all four screws gradually in a cross pattern. The heatsink should be secure without bending the board.
6. Before restoring power, check that the fins do not touch the enclosure, cables or other boards.

Passive cooling requires airflow around the fins. In closed enclosures, warm environments or under sustained load, the heatsink may be complemented by enclosure ventilation; on its own it cannot guarantee a specific temperature.

This product is for you if

• You use a CB1 or CB1 eMMC on a compatible BIGTREETECH carrier.
• You want to improve cooling without adding noise or power consumption.
• Your assembly has the required clearance and mounting points.

This product is not for you if

• Your module is a CB2, Raspberry Pi CM4 or another single-board computer.
• The enclosure has no clearance above the fins.
• You need active cooling for a very warm enclosure or one with no airflow.

This product is the heatsink assembly. The CB1, carrier board, fan and other electronics shown in the images are not included.