0.6 g High Thermal Conductivity Thermal Paste for Hotends and Electronic Components

This high thermal conductivity thermal paste improves heat transfer between two metal surfaces by reducing thermal resistance at the interface. It is particularly suitable for all-metal hotends, where it is applied between the heatbreak and the heatsink to optimize heat dissipation.

This is the same thermal paste we pre-apply to our assembled V6 hotends.

Features

• High thermal conductivity thermal paste.
• Improves heat transfer between metal surfaces.
• Ideal for all-metal hotends and electronic components.
• Ready to use.
• 0.6 g single-use package.

Technical Specifications

• Color: White.
• Net weight: 0.6 g.
• Thermal conductivity: > 1.22 W/m·K.
• Thermal resistance: < 0.201 °C·in²/W.
• Operating temperature: -50 °C to 180 °C.
• Evaporation: < 0.001%.

Applications

Suitable for all-metal hotends, heatsinks, MOSFETs, electronic modules, processors, high-power LEDs and any application requiring improved thermal transfer between two surfaces.

Package Contents

• 1 × 0.6 g thermal paste sachet.